Lee E. Schauer Scholarship

Published Date: January 22, 2018

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Scholarship details

  • Area of study

    All
  • Country of the Scholarship

    United States
  • Scholarship Valid Until (Year)

    2020
  • Type of scholarship

    Bachelor's scholarship
  • Scholarship amount given

    9000 - 12000
  • Type of scholarship administrator

    Private sponsor
  • Mode of scholarship (Online/Offline)

    Online
  • Applier's country

    United States
  • Expenses covered

    Tuition fees
  • Scholarship Contact Details

    Scholarship Selection Committee Sidney-Shelby County YMCA 300 E. Parkwood Street Sidney, OH 45365 Info@sidney-ymca.org Tel: 937-492-9134 X206 Fax: 937-492-4705

The Lee E. Schauer Memorial Scholarship was established during 1989. It was established the family and friends to honor the memory of Lee E. Schauer who was a great man who lost his life in a tragic accident during the summer days before his senior year of high school.

It is the desire of the Schauer family that this scholarship will be a grant to a college-bound high school senior high student and it is for whom the award will truly make a difference. Because of that, the award is intended to reach those students who may not qualify some scholarship offered somewhere else. Average students who are involved in their community and in school activities may also join. Leaders who display character traits like caring for each other, being honest, being respectful and is taking hold of responsibility, and for those whose GPA makes them not eligible for other scholarships.

A GPA of 2.5 or higher is not required. It is only for a qualifying criterion and will not be given weight in the selection process. A YMCA membership is not required, however, student applicants who are current members of YMCA and has also volunteered will be given additional consideration. Must have participated in sports or fitness activities. COmmitment to community service as a volunteer, particularly at the Y must be acquired. There must be a documentation in the process.

Application due date:  April 06, 2018


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